The interesting part is the E-Core on A19 Pro are nearly as good as the previous ARM Big Core while only using half the power. I would love to know the die size of the cache and E-Core.
ARM were catching up to Apple in terms of big core, now Apple has leapfrogged in E-Core again. But competition is good. ARM should have some announcement coming in next few months.
It's definitely an "on the shoulders of giants standing on the shoulders of giants" thing. Insane breakthrough technologies on top of other insane breakthroughs. Firing lasers at microscopic molten drops of metal in a controlled enough manner to get massively consistent results like what??
It’s a mind blowing achievement, nothing below sorcery if you think about it.
ASML machines are hitting tin droplets with 25kW laser 50,000 times a second to turn them into plasma to create the necessary extreme ultraviolet light, and despite generating 500W of EUV, only a small fraction can reach the wafer, due to loses along the way. I believe it was like 10%.
There is no backside anything here. This may be a photo of a thinned die; silicon is somewhat transparent so you can often see the die structures better from the back because it isn't blocked by the metal stack.
English subtitles are recommended, unless you are better at Chinese than I am.
ARM were catching up to Apple in terms of big core, now Apple has leapfrogged in E-Core again. But competition is good. ARM should have some announcement coming in next few months.
This definitely isn't the original, since the blue text at the bottom right isn't even legible.
The A19 appears to be remarkably intricate chip.
"High Resolution Floorplan images available here"
With some contact info below that
It is moved to the end of the page on mobile it seems
ASML machines are hitting tin droplets with 25kW laser 50,000 times a second to turn them into plasma to create the necessary extreme ultraviolet light, and despite generating 500W of EUV, only a small fraction can reach the wafer, due to loses along the way. I believe it was like 10%.
Here’s an incredible, very detailed video about it: https://youtu.be/B2482h_TNwg
Maybe the high water usage is at some other stage? Or intermediate preceding stages?
As someone who knows nothing about PCB, from those images it appears that double side printing of some sort is happening.
Please correct me if I'm wrong.
I think what you're seeing is the silicon layers visible from the back through the bulk substrate, and the metal layers on the front.